In recent years, the price of laser marking machines has been declining, from the original 10,000 to 20,000 to the current 20,000 to 3,000. The machine is getting cheaper and cheaper, which has caused users to ignore daily maintenance, so that the machine often has minor problems, and even Many users do not know how to maintain the stamp engraving machine correctly. Below I will summarize the maintenance methods and precautions during work for you:. Before work, first check the circulating water. If the work is carried out without water, the engraving effect will become shallower and shallower, and even cause the laser tube of the laser marking machine to break, causing great economic losses (if the work is carried out without water , you should immediately turn off the machine and cut off the power supply, wait for half an hour and then test with water). The weather is hot in summer, so pay attention to the water temperature and try to use a larger bucket. If the water temperature rises, replace it with cold water. In winter, it is colder. Remember not to freeze the circulating water. You can put an appropriate amount of antifreeze in the water.
The circulating water of the laser marking machine should be replaced frequently, and there should be no sundries in the water. Both the stamp engraving machine and the host computer should be grounded before working (the iron rod needs to be in contact with the soil when it is smashed into the soil). The guide rails and small wheels should be cleaned frequently and injected with engine oil for lubrication.
Wipe the lens frequently (use alcohol cotton ball) to prevent the lens from being dirty and cause shallow engraving. Frequently clean the moisture and sundries inside the stamp engraving machine to prevent moisture from causing adverse effects on the circuit (you can use a hair dryer to dry it after cleaning). Na:YAG laser light source is commonly used for silicon wafer cutting. Silicon wafer laser cutting uses laser irradiation to cause silicon wafer overflow until the material is melted and vaporized. Due to the light pressure and the recoil pressure of vaporized substances, the melt is discharged from the incision. Nd: The YAG laser is modulated into a pulse type, the pulse frequency is 1-50kHz, and the beam is focused into a spot with a diameter of about 0.1mm. When the laser energy density can reach 1~1 J/c, the laser radiation A crescent crater is formed on the surface of the silicon wafer, the laser moves relative to the silicon wafer plate, and two crescent craters overlap to form a continuous scribe line (ablation line) on the surface of the silicon wafer, and then the silicon is easily moved along the direction of the ablation line by mechanical means. The main advantages of laser cutting silicon wafers are: the width of the cutting line is less than a.25mm, the cutting depth is 2-3 times deeper than that of diamond scribing, and the yield rate is greatly improved. The yield rate reaches 96I^-98%, and the cutting stress Small, sharp edge, no cracks for brittle materials. If continuous YAG laser cutting is used to cut silicon wafers, traces of thermal effects can be observed on the cutting edge. At the same time, the edge of melting and vaporization of Si wafers cannot be strictly controlled. Sputtering is also uncontrollable, so the edge of the cut silicon wafer is not very sharp, and the depth of the surface unevenness is about 50 Bay Tn.
Traditional silicon wafer cutting uses high-speed rotating blades or King Kong IC automatic laser marking machine to pre-cut the silicon wafers, and then open them according to the direction of the cutting marks. Since the blades have a certain thickness, using this method will cause raw materials Waste, secondly, scribing will produce cracks, debris and other problems, especially at the intersection of scribing lines, the blade damage is serious, and the yield is low. In recent years, researchers have tried to use low-energy UV lasers instead of diamond knives to cut microchips. When the chip is processed, the special optical system of the laser device focuses the ultrashort-wave laser into a laser beam with a diameter of only a few microns. Using this energy concentrated in a specific space and time to irradiate the silicon wafer to be processed, a laser can be directly punched inside the material. Closely adjacent small pores, this is“to drill”hole material can be easily“open book”, to obtain an ideal microchip. The entire cutting process carried out by this method is automatically carried out under computer control, which is fast and accurate. Secondly, because the laser holes on the sapphire and silicon wafers are extremely small, it will not cause damage to the chip material. waste. Zhuhai Correct Pack is a well-known laser equipment manufacturer in China. It has been focusing on the development and production of laser equipment for 12 years, providing customers with a complete set of laser equipment solutions, and creating cost-effective laser equipment. Main business: UV, co2, fiber laser marking machines, laser radium engraving machines And other cost-effective laser equipment, national service hotline: 400-0098-266https://www.xmslaser.com/.